Oh sure, liquid cooling rigs are all the rage, but they aren’t too useful within minuscule things like netbooks, MIDs and pocket projectors. The always churning minds over at Fraunhofer-Gesellschaft are already on the issue, recently conjuring up a new material designed to “efficiently dissipate heat even in devices with densely packed components and that can give increasingly miniaturized electronics a longer life.” Researchers at the entity’s Institute for Manufacturing Engineering and Applied Materials Research have teamed with gurus from Siemens and Plansee to create the substance as part of the EU project “ExtreMat.” Unfortunately, details beyond that are few and far between, but given that demonstrations have reportedly “already been produced,” we’d say it’s well on its way to infiltrating things far smaller than your mind can grasp.
Filed under: Misc. Gadgets, Science
New cooling material keeps heat down in densely packed electronics originally appeared on Engadget on Thu, 09 Apr 2009 03:17:00 EST. Please see our terms for use of feeds.
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Original post by Darren Murph
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