HTC said to be dipping into Ericsson’s silicon for 3.5G chipsets
Filed under: HTC
Digitimes claims that HTC intends to launch a 10-strong mix of WinMo and Android handsets in 2009 — sounds about right, if we had to guess — and not all of ‘em will be Qualcomm powered. Apparently, HTC’s HSPA devices will employ guts from Ericsson’s Mobile Platforms group, and as lucrative contracts go, the HTC’s chipset contract going into a serious Android year has to be at or near the top. Funny how HTC makes the X1 for Sony Ericsson and Ericsson makes chips for HTC, but business is business, eh?
[Via wmpoweruser.com]
HTC said to be dipping into Ericsson’s silicon for 3.5G chipsets originally appeared on Engadget Mobile on Wed, 07 Jan 2009 15:40:00 EST. Please see our terms for use of feeds.
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Original post by Chris Ziegler
